• Product Engineering
  • China

Responsibilities:

  • Responsible for the formulation of technical solutions and process improvement of high-speed device packaging process;
  • Responsible for the development of devices and the proposal of technical solutions in the production process;
  • Strictly implement the quality management standard, propose to improve the device process, improve the product yield, and reduce the production cost.

Requirement:

  • Bachelor degree or above, major in microelectronics, semiconductor physics, electronic engineering or related;
  • At least 3 years experience in optical device packaging;
  • Familiar with semiconductor optoelectronic device packaging technology;
  • Strong communication skills, team spirit and sense of responsibility;
  • Good English reading and writing skills

Application:

To apply, please email career@cloudlight.com.hk with your resume, your availability to report duty and quote the Job Ref.

Only short-listed candidates will be notified. Personal data provided by applicants will be used for consideration of an application only.

Application Deadline

Until this position is filled. Resumes received will strictly be used for recruitment-related purpose.

To apply for this job email your details to career@cloudlight.com.hk