With continued R&D and investment in our core technologies in optoelectronics packaging, precision assembly technology, advanced testing capabilities and reliability engineering, Cloud Light is able to stay ahead of industry requirements and offer very high-volume manufacturing of high-performance optical data transmission and optical sensing products at the lowest possible field defect rates .


Optoelectronics Packaging

Cloud Light optical data transmission and sensing products are based on its unique chip-on-board (COB) and chip-on-submount (COS) optical engine platforms which are designed to offer unmatched product design flexibility with exceptional optical, RF and thermal performance that exceeds requirements for next generation products.

Supported transmission data rate exceeds 100Gb/s per lane over single-mode or multi-mode fiber.


High-precision Process and Assembly

Cloud Light products are fabricated with our advanced manufacturing platform with automated high-precision semiconductor wafer processes (dicing, polishing, metallization, etc.) and optoelectronics component assembly processes (die bond, wire bond, flip-chip bonding, passive/active optical alignment, etc.) at sub-micron alignment precision.

All manufacturing processes are carried out in our Class 1k clean rooms with ESD control capability at 20V or below.


Advanced Testing Capabilities

High-volume automated product testing and burn-in are made possible by Cloud Light’s extensive experience in product testing methodologies and fully customized automatic test handlers and burn-in testers.

In-house designed automated wafer-level optoelectronic component testing and silicon photonics optical / electrical testing support wafer size up to 12”.


Reliability Engineering

Cloud Light has extended optical product reliability engineering experience with products fully qualified into automotive, enterprise and datacenter applications.

To maintain the highest level of product reliability, our fully-equipped reliability lab enables complete suite of reliability tests to be conducted at component and product level.

When failure did occur, our direct access to advanced surface and device failure analysis tools, such as, TEM, SEM, SIMS, etc. enables thorough failure analysis to identify the root causes of the failure.